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Brand Name : INTEL/ALTERA
Model Number : EP4CE30F29C8N
Place of Origin : original
MOQ : 1
Price : Negotiable
Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability : 999999
Delivery Time : 1-3 days
Packaging Details : standard
Total RAM Bits : 608256
Voltage - Supply : 1.15V ~ 1.25V
Mounting Type : Surface Mount
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 780-BGA
Supplier Device Package : 780-FBGA (29x29)
PN : EP4CE30F29C8N
EP4CE30F29C8N Programmable IC Chip
 Field Programmable Gate Array (FPGA) IC 532 608256 28848   Package 780-BGA
| Number of LABs/CLBs | 1803 |  | 
| Number of Logic Elements/Cells | 28848 |  | 
| Total RAM Bits | 608256 |  | 
| Number of I/O | 532 |  | 
| Voltage - Supply | 1.15V ~ 1.25V |  | 
| Mounting Type |  | |
| Operating Temperature | 0°C ~ 85°C (TJ) |  | 
| Package / Case |  | |
| Supplier Device Package | 780-FBGA (29x29) |  | 
| Base Product Number | 
Power Consumption
 Use the following methods to estimate power for a design:
 ■ the Excel-based EPE
 ■ the Quartus II PowerPlay power analyzer feature
 The interactive Excel-based EPE is used prior to designing the device to get a
 magnitude estimate of the device power. The Quartus II PowerPlay power analyzer
 provides better quality estimates based on the specifics of the design after
 place-and-route is complete. The PowerPlay power analyzer can apply a combination
 of user-entered, simulation-derived, and estimated signal activities that, combined
 with detailed circuit models, can yield very accurate power estimates.
Switching Characteristics
 This section provides performance characteristics of Cyclone IV core and periphery
 blocks for commercial grade devices.
 These characteristics can be designated as Preliminary or Final.
 ■ Preliminary characteristics are created using simulation results, process data, and
 other known parameters. The upper-right hand corner of these tables show the
 designation as “Preliminary”.
 ■ Final numbers are based on actual silicon characterization and testing. The
 numbers reflect the actual performance of the device under worst-case silicon
 process, voltage, and junction temperature conditions.

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